Products


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Tsi564A Feature SheetDevice22006/07/20PDF (99 KB)
Tsi564A Feature Sheet - JapaneseDevice12007/05/16PDF (562 KB)
Tsi564A Feature Sheet - ChineseDevice12007/05/16PDF (687 KB)
Tsi564A User ManualDevice42007/06/27PDF (1 MB)
Tsi564A Hardware ManualDevice42007/06/12PDF (944 KB)
Tsi564A/Tsi574 Device DifferencesDevice52007/01/19PDF (319 KB)
Tsi564A Device Errata and Design NotesDevice32007/06/06PDF (217 KB)
Tsi56x Software Initialization Design NoteApp Note52005/07/07PDF (306 KB)
Using Serial RapidIO for Inter-chassis App Note32005/11/11PDF (1 MB)
Tsi56x Debug ChecklistHardware12005/12/12PDF (223 KB)
Tsi564A Board Design Guidelines Hardware12005/06/13PDF (1 MB)
Tsi564A PinlistHardware32006/09/19TXT (5 KB)
Tsi564A BallmapHardware12005/04/19PDF (20 KB)
RapidIO Tools
These hardware and software tools are specially designed to evaluate RapidIO-based applications.
Hardware12008/08/24Internal URL
Tsi56x Initialization CodeSoftware22005/05/13ZIP (4 KB)
Tsi564A Header FileSoftware12005/06/21H (253 KB)
JTAG Register Access Software V08_08Software92008/08/12EXE (371 KB)
JTAG Register Access Software Application NoteSoftware52008/10/07PDF (147 KB)
Tsi564 BSDL FileModel32005/09/26BSDL (24 KB)
Tsi564 IBIS ModelModel12007/01/08IBS (282 KB)
Tundra RapidIO Switches - A Quantum Leap in Performance for VMETech Brief32007/01/29PDF (137 KB)
RapidIO: The Obvious Interconnect ChoiceTech Brief12008/01/23PDF (219 KB)
Optimizing Baseband Interconnect in DSP-Based 3G BasestationsTech Brief12006/11/28PDF (249 KB)
Addressing the Signal Integrity Challenges in High-Speed Serial I/O InterfacesTech Brief32008/04/08PDF (437 KB)
Tundra Product Guide - Summer 2008General52008/06/18PDF (1 MB)
ASE to Standardize the Solder Ball Composition for all BGA Flip-Chip Devices PPCNPPCN12006/03/20PDF (24 KB)
Country of Origin Marking to be Identified on Substrates PPCNPPCN12006/05/02PDF (26 KB)
C4 Solder Bump on Flip-Chip Devices Change from Pb-free to Eutectic PPCNPPCN12006/04/07PDF (24 KB)
Tsi564A Pb-Free Production Status PPCNPPCN12007/06/28PDF (16 KB)
Tsi564A Production Status PPCNPPCN12006/02/02PDF (60 KB)
Adding Another ASE Assembly Line for Flip-Chip Devices PPCNPPCN12008/07/16PDF (16 KB)