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+ HyperTransport Bridges
- Tsi308
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+ PCI Express Bridges
- Tsi384
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+ PCI/X Bridges
- Tsi352
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+ Power Controllers
- Tsi257
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+ RapidIO Switches
- Tsi620
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+ RapidIO Tools
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- Tsi148
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Technical Briefs
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- Tsi500
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- 8000 Series

	Document Title	\|	Type	\|	Version	\|	Release Date	\|	File Info

Tsi109 Feature Sheet	Device	5	2006/07/21	PDF (86 KB)

Tsi109 Feature Sheet - Japanese	Device	1	2006/10/16	PDF (181 KB)

Tsi109 Feature Sheet - Chinese	Device	1	2006/10/16	PDF (281 KB)

Tsi108/Tsi109 User Manual	Device	7	2006/06/14	PDF (4 MB)

Tsi108/Tsi109 Device Differences	Device	5	2006/06/02	PDF (97 KB)

Tsi108/Tsi109 Hardware Manual	Device	8	2007/08/08	PDF (2 MB)

Tsi109 Device Errata	Device	6	2008/02/05	PDF (86 KB)

Tsi109 Design Notes	Device	1	2008/02/05	PDF (67 KB)

Tsi109/Tsi110 Device Differences	Device	1	2007/02/15	PDF (61 KB)

Tsi108/Tsi109 Software Initialization Application Note	App Note	6	2007/03/07	PDF (295 KB)

Tsi108/Tsi109 Schematic Review Checklist	Hardware	3	2005/11/23	PDF (186 KB)

Tsi109 and MPC7448 PrPMC Reference Design Kit	Hardware	1	2006/07/04	ZIP (5 MB)

Tsi109 Pinlist	Hardware	2	2005/11/23	TXT (15 KB)

Tsi109 Dual MPC7448 Reference Design Schematic	Hardware	3	2007/06/26	PDF (2 MB)

Tsi109 Dual MPC7448 Reference Design	Hardware	2	2007/07/05	ZIP (735 KB)

Tsi108/Tsi109 Debug Checklist	Hardware	1	2006/05/18	PDF (31 KB)

Tsi109 Header File	Software	1	2005/12/05	ZIP (33 KB)

Tsi108/Tsi109 U-Boot Initialization Code	Software	2	2005/07/25	ZIP (5 MB)

Tsi108/Tsi109/750GX U-Boot 1.1.4 Initialization Code	Software	1	2006/08/11	ZIP (6 MB)

Tsi108/Tsi109/Tsi110 Ethernet Driver Performance Patch for Linux 2.6.22	Software	1	2007/12/05	ZIP (3 KB)

Tsi109 BSDL File	Model	5	2005/11/28	TXT (97 KB)

Tsi109 IBIS Model - Commercial Temperature Range	Model	1	2006/06/15	ZIP (357 KB)

Tsi109 IBIS Model - Industrial Temperature Range	Model	2	2007/01/19	ZIP (359 KB)

Addressing the Signal Integrity Challenges of PowerPC Designs	Tech Brief	5	2007/01/31	PDF (710 KB)

Overcoming PowerPC System Design Challenges	Tech Brief	1	2007/11/30	PDF (532 KB)

Tsi108/Tsi109 Benchmark Summary	Tech Brief	2	2007/03/29	PDF (471 KB)

Tundra Product Guide - Summer 2008	General	5	2008/06/18	PDF (1 MB)

Adding Another ASE Assembly Line for Flip-Chip Devices PPCN	PPCN	1	2008/07/16	PDF (16 KB)

ASE to Standardize the Solder Ball Composition for all BGA Flip-Chip Devices PPCN	PPCN	1	2006/03/20	PDF (24 KB)

C4 Solder Bump on Flip-Chip Devices Change from Pb-free to Eutectic PPCN	PPCN	1	2006/04/07	PDF (23 KB)

Country of Origin Marking to be Identified on Substrates PPCN	PPCN	1	2006/05/02	PDF (26 KB)

Tsi109 Production Status PPCN	PPCN	1	2006/03/01	PDF (64 KB)

Tsi108/Tsi109/Tsi110 Change in Test Location PPCN	PPCN	1	2008/05/29	PDF (12 KB)