The Tundra Tsi109™ is an evolution of the industry leading Tsi108 advanced host bridge for PowerPC® processors. In addition to standard Tsi108 features -- PCI-X, DDR2-400 SDRAM, Gigabit Ethernet, and Flash -- the Tsi108, the Tsi109 supports dual CPU operation, boasts an improved memory pipeline, offers integrated power management and industrial temperature operation. The Tsi109 is also pin and software compatible with the Tsi108 for those who want to boost performance in existing designs.

The Tsi109 builds on a decade of Tundra design experience in PowerPC host bridging. It delivers industry-leading performance for customers in the wireless infrastructure, storage networking, network access, printer, military, and industrial automation markets.

Business Benefits

Superior System Performance

Dual-processor support on the Tsi109 allows designers to significantly enhance system performance in CPU intensive applications. Industry benchmarking proves the upgraded memory pipeline offers the best CPU to memory performance of any PowerPC host bridge. The device's Ethernet Controller and PCI-X Interface offer superior data transfer rates.

Lowers System Power

Aside from having the lowest power dissipation of any off-the-shelf host bridge, the Tsi109’s support for DDR2 provides memory power savings of up to 50% compared with DDR. The Tsi109 also minimizes active power by disabling unused ports and clocks, while its integrated Clock Generator saves power over discrete devices. The Tsi109 conforms to the PCI Bus Power Management Interface Specification.

Lowers System Cost

The industry leading features and integration of the Tsi109 allow system designers significant system cost savings versus other off-the-shelf host bridges. DDR2 support means memory costs are lower by as much as $20 as compared to using DDR. And the integrated Clock Generator with spread spectrum saves up to $10 versus using discrete devices with other host bridges. PCB costs are also lowered due to space savings resulting from feature integration, and the high reliability design can mean lower PCB costs. As well, the processor bus design at 200 MHz can be implemented with only 8 layers with the MPC7448 or 750GX. Integrated power management allows the processor, memory, and PCI/X devices to be powered down in idle modes – key for printers and other consumer appliances.

Configurability

Tsi109's flexible configuration options empower designers to develop their systems quickly and efficiently. Single or dual CPU operation, selection of PCI/PCI-X modes, an integrated Clock Generator, DDR2 support, and the ability to configure it as a PCI Host/Agent, all enable the Tsi109 to be used in a range of applications. The JTAG Interface also simplifies the debug process by allowing access to Tsi109's registers without impacting active transactions.

Excellent Signal Integrity

The device’s package was designed to maximize product reliability. Flip-chip packaging offers better electrical and thermal characteristics than wire-bond packaged host bridges. VSS within I/O signals keeps I/O return current out of the core and is used as shields within the package to further reduce noise. VDD references within the memory and processor signals reduces coupling and noise from these high-speed interfaces and keeps I/O current out of the core. The generous power and ground signals in a checkerboard pattern reduce the length of current loop between power and ground and provide the optimum pattern for effective decoupling. DDR2 support also offers superior signal integrity due to on-die termination.

Integration

The Tsi109 feature set provides system designers with an array of integrated functionality to assist in lowering overall system power and cost, such as an integrated Clock Generator with spread-spectrum capabilities, a DDR2-400 Memory Controller, dual Gigabit Ethernet, power management, and internal processor and PCI/X bus arbiters.