
The Tundra Tsi108™ is an advanced host bridge for PowerPC® processors that supports PCI-X, DDR2-400 SDRAM, Gigabit Ethernet, and Flash. The device contains numerous integrated features that enable customers to reduce system design complexity and system costs. As a result, the Tsi108 has the best price/benefits ratio on the market. The Tsi108 builds on a decade of Tundra design experience in PowerPC host bridging. It delivers industry-leading performance for customers in the wireless infrastructure, storage networking, network access, printer, military, and industrial automation markets. Business BenefitsLowers System CostThe industry leading features and integration of the Tsi108 allow system designers significant system cost savings versus other off-the-shelf host bridges. DDR2 support means memory costs are lower by as much as $20 as compared to using DDR. And the integrated Clock Generator with spread spectrum saves up to $10 versus using discrete devices with other host bridges. PCB costs are also lowered due to space savings resulting from feature integration, and the high reliability design can mean lower PCB costs. As well, the processor bus design at 200 MHz can be implemented with only 8 layers with the MPC7448 or 750GX. Lowers System PowerAside from having the lowest power dissipation of any off-the-shelf host bridge, the Tsi108's support for DDR2 provides memory power savings of up to 50% when compared with DDR. The Tsi108 also minimizes active power by disabling unused ports and clocks, while its integrated Clock Generator saves power over discrete devices. The Tsi108 conforms to the PCI Bus Power Management Interface Specification. Superior System PerformanceThe advanced Switch Fabric architecture of the Tsi108 allows designers to significantly enhance system performance. The Ethernet Controller and PCI-X Interface offer superior data transfer rates. In addition, CPU to memory performance is exceptional due to features like configurable port arbitration priority and queuing reads ahead of writes. Excellent Signal IntegrityThe Tsi108's package was designed to maximize reliability. Flip-chip packaging offers better electrical and thermal characteristics than wire-bond packaged host bridges. VSS within I/O signals keeps I/O return current out of the core and is used as shields within the package to further reduce noise. VDD references within the memory and processor signals reduces coupling and noise from these high-speed interfaces and keeps I/O current out of the core. The generous power and ground signals in a checkerboard pattern reduce the length of current loop between power and ground and provide the optimum pattern for effective decoupling. DDR2 support also offers superior signal integrity due to on-die termination. IntegrationThe Tsi108 feature set provides system designers with numerous integrated functionality to assist with lowering overall system cost, such as an integrated Clock Generator with spread-spectrum capabilities, a DDR2-400 Memory Controller, dual Gigabit Ethernet, and PCI/X bus arbiters. ConfigurabilityTsi108's flexible configuration options empower designers to develop their systems quickly and efficiently. Selection of PCI/PCI-X modes, an integrated Clock Generator, DDR2 support, and the ability to configure it as a PCI Host/Agent, all enable the device to be used in a range of applications. The JTAG Interface also simplifies the debug process by allowing access to the device's registers without impacting active transactions. |