Products


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Tsi107 Feature SheetDevice42006/07/20PDF (88 KB)
Tsi107 Feature Sheet - JapaneseDevice12006/10/16PDF (144 KB)
Tsi107 Feature Sheet - ChineseDevice12006/10/16PDF (268 KB)
Tsi107 User ManualDevice42006/02/24PDF (6 MB)
Tsi107 Hardware SpecificationDevice62007/01/11PDF (381 KB)
Tsi107 Device ErrataDevice42007/06/07PDF (157 KB)
Tsi107 Revision 1.3/1.4 Device DifferencesDevice12003/10/29PDF (117 KB)
Tsi106/Tsi107 Device DifferencesDevice12006/03/23PDF (393 KB)
Valis X3 MPC7451 PMC Module
The Valis X3 MPC7451 PMC Module (Part No. PPCEVAL-SP3-7451) is a PCI Mezzanine Card (PMC) with the MPC7451 host processor and demonstrates the capabilities of Motorola PowerPC processors and the Tundra Semiconductor Tsi107 host bridge.
App Note12008/07/15External URL
Designing a Tsi107 Local Bus Slave InterfaceApp Note12003/11/13PDF (347 KB)
Using ECC Memory Configuration and Error Injection and Detection with the Tsi107App Note22007/03/16PDF (559 KB)
System Design and Troubleshooting Application NoteApp Note12001/12/20PDF (39 KB)
Tsi107 PinlistHardware22008/09/17TXT (7 KB)
Tsi107 Schematic SymbolHardware12003/12/19PDF (231 KB)
Tsi107 Design GuideHardware12003/10/29PDF (981 KB)
Initializing Blank Flash Devices on Embedded Platforms Application NoteHardware12003/11/04PDF (106 KB)
Tsi107 C Header FileSoftware22004/05/25H (77 KB)
Tsi107 IBIS ModelModel22006/01/16ZIP (70 KB)
Tsi107 BSDL FileModel12003/11/06TXT (76 KB)
Altimus X3 MPC7410 PMC Module
The Altimus X3 MPC7410 PMC Module (Part No. PPCEVAL-SP3-7410) is a PCI Mezzanine Card (PMC) with the MPC7410 Host Processor and demonstrates the capabilities of Motorola PowerPC processors and the Tundra Semiconductor Tsi107 host bridge.
Model12008/06/26External URL
Altimus X3 MPC755 PMC Module
The Altimus X3 MPC755 PMC Module (Part No. PPCEVAL-SP3-755) is a PCI Mezzanine Card (PMC) with the MPC755 host processor and demonstrates the capabilities of Motorola PowerPC processors and the Tundra Semiconductor Tsi107 host bridge.
Model12008/06/26External URL
Tundra Tsi107 versus Marvell Discovery IITech Brief22007/03/20PDF (241 KB)
Addressing the Signal Integrity Challenges of PowerPC DesignsTech Brief52007/01/31PDF (710 KB)
Tsi107 NTK Substrate ASE K11 Plant Qualification ReportGeneral12008/10/07PDF (48 KB)
Tundra Product Guide - Summer 2008General52008/06/18PDF (1 MB)
ASE to Standardize the Solder Ball Composition for all BGA Flip-Chip Devices PPCNPPCN12006/03/20PDF (24 KB)
Tsi106/Tsi107 Part Number Change PPCNPPCN12003/09/25PDF (67 KB)
Tsi107 Branding and Package Change PPCNPPCN12004/08/12PDF (58 KB)
ASE is Sole Source for Assembly and Test of Tsi107 PPCNPPCN22006/05/03PDF (25 KB)
Tsi107C Tape and Reel Quantity Change to ASE Standard PPCNPPCN12005/12/22PDF (23 KB)
Kinsus Added as Alternative Source for Tsi107 Substrates PPCNPPCN12006/10/13PDF (24 KB)
Adding Another ASE Assembly Line for Flip-Chip Devices PPCNPPCN12008/07/16PDF (16 KB)