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Tundra Semiconductor Releases Q3-Fiscal 2008 Financial ResultsResults in Line with Guidance, Positive Outlook for Q4Ottawa, Ontario – February 28, 2008 – Tundra Semiconductor Corporation (TSX:TUN) (“Tundra” or “Company”), a leader in System Interconnect, today reported financial results for the third quarter of fiscal 2008, which ended January 27, 2008. Revenue for the quarter fell within the financial guidance provided in November and management’s outlook for the fourth quarter indicates 10-20% sequential growth.Q3-2008 RESULTS:* Q3 Revenue: $14.7 million * Q3 Pro forma earnings: $0.3 million * Q3 Pro forma diluted earnings per share: $0.02 * Q3 GAAP results: loss of $54.0 million or $2.72 per diluted share, as a result of goodwill impairment charges Revenue for the third quarter of fiscal year 2008 was $14.7 million, comprised of $5.7 million in the Communications market segment, $7.1 million in the Computing/Storage market segment, and $1.9 million in Design Services. Quarterly revenue represents a $7.0 million decrease over the third quarter in fiscal year 2007, and a $3.2 million decrease from the second quarter of fiscal year 2008. Pro forma earnings of $0.3 million represent a $2.7 million decrease compared to the third quarter of fiscal year 2007, and a $0.6 million decrease over the second quarter of fiscal year 2008. On a GAAP basis the Company had a loss for the quarter of $54.0 million or $2.72 per diluted share, which primarily reflects goodwill impairment charges of $50.6 million, stemming from the current market environment and its impact on share valuation. GAAP losses for the quarter compare to a gain of $1.3 million or $0.06 per diluted share in the third quarter of fiscal year 2007, and compare to a loss of $0.7 million or $0.04 per diluted share in the second quarter of fiscal year 2008. “Our Q3 results were within the guidance we provided for the quarter. On a pro forma basis, we remained profitable, primarily as a result of the restructuring activity we executed in November to offset the downturn in the Communications market and the negative impact of the strong Canadian dollar.” said Daniel Hoste, President and Chief Executive Officer. “Our outlook for the fourth quarter indicates a 10-20% sequential growth rate and we are pleased with early indicators in the quarter that show an improving business environment to end the fiscal year. Design win activity in our key product lines (RapidIO, PCI Express and VME) and in particular from our Tier 1 customers, continues to confirm our projections for future growth,” continued Hoste. Management offers the following outlook for the fourth quarter of fiscal year 2008:* Revenues are expected to be in the range of $16 million to $18 million * Pro forma diluted earnings per share are expected to be in the range of $0.04 per share to earnings of $0.07 per share Q3-2008 Highlights:Corporate Highlights:* Richard Riker joined Tundra’s Leadership team in January in the role of Vice President Sales with responsibility for leading the Company's global sales organization. Richard's successful 28 year career in the semiconductor industry includes over 18 years of senior management experience leading worldwide sales organizations and developing and implementing winning business strategies. Richard's experience adds strength to Tundra's Leadership Team, with his primary focus on growing the Company's global business by penetrating new markets with the Company's leading System Interconnect portfolio and new smart System Interconnect solutions. Prior to joining Tundra, Richard held a variety of executive and management positions within Anadigm Inc., Vitesse Semiconductor, Intel, Digital Equipment Corporation, Inmos Corporation, and Texas Instruments Corporation. * Ed Vopni has been appointed Vice President Engineering. Ed joined Tundra in September 2003 in the role of Director Engineering and was appointed to Vice President Operations in March 2007. Ed brings with him over 25 years experience in progressively senior management positions from such companies as Gennum, Mitel, Nortel (both in Canada and the UK) and IceFyre Semiconductor. Ed will continue to lead the Operations team on an interim basis, in addition to his responsibility for the company’s Engineering teams. * Tundra recently began executing on expansion plans in its Hyderabad, India design centre. Tundra plans to expand its engineering capacity in Hyderabad with specific focus in; ASIC Design/Verification, Physical Implementation, Chip Integration, and Embedded Software Design. The Hyderabad design team will work on developing new and innovative products, using cutting edge process technologies, for Tundra’s next generation smart System Interconnect solutions. The growing high tech hub in Hyderabad is receiving world-wide recognition for its pool of talented design engineers. Tundra’s experienced team in Hyderabad has added significantly to the successful delivery of new PCI Express products. * In the quarter, Tundra announced a distribution agreement with Uniquest Corporation, an award winning distributor in Korea. Uniquest will now promote and distribute Tundra’s full range of System Interconnect products in the rapidly growing Korean market. Uniquest is a well respected, technical distributor that often receives industry awards from global Tier 1 partners and customers for its outstanding performance. Product Highlights:* At the Texas Instruments Developers Conference this week, Tundra announced the availability of the market’s first end-to-end RapidIO®-enabled MicroTCA™ platform for wireless baseband. The “baseband-in–a-box“ platform offers 10 Gigabit RapidIO Interconnect for chip-to-chip and board-to-board links across the backplane. The platform will allow wireless telecommunication system vendors to expedite their go-to-market schedule with this “baseband-in-a-box” solution. Production-ready components, available now, will speed wireless infrastructure design cycles and free up designer resources to focus on application firmware and software development. Leveraging the industry’s leading semiconductor components from; Tundra, Texas Instruments, Mercury Computer Systems, CommAgility, and Fabric Embedded Tools, wireless base station vendors can now go to market in full volume production, ahead of their competition. * Tundra’s design services division, SLE, recently announced the availability of a new 150Gb/s High Speed Interlaken protocol IP core for use in ASIC designs. The new Interlaken IP Core is now available with more than twice the performance of the standard 60Gb/s version. The Interlaken core delivers the performance and bandwidth that new designs require, now with higher data transfer rates. With full scalability, the core is ideally suited for multiple generations of future network switches, routers and storage equipment. * Tundra recently launched the Tsi382™, a small form-factor, high performance bridge that connects a single lane PCI Express (x1 PCIe) interface to the PCI bus standard. The device’s 32-bit PCI Interface can operate up to 66 MHz in PCI mode. This interface offers designers extensive flexibility by supporting three types of addressing modes: transparent, opaque, and non-transparent. The Tsi382 is suited for applications that need to bridge from PCIe to conventional 32-bit PCI devices. The Tsi382 responds to specific customer demand for a small footprint PCIe bridge, and ideally suited for applications where board space is limited. CONFERENCE CALL AND WEBCASTTundra management will be holding a conference call today, February 28, 2008 at 5:00 p.m. EST to discuss additional details regarding this earnings update. You may access the conference call via any of the following:Teleconference: +1.416.644.3424 Replay: +1.416.640.1917 Passcode: 21262751#. The replay will be available through March 6, 2008. Web Cast: http://www.newswire.ca/en/webcast/viewEvent.cgi?eventID=2167440 Access the PDF of the Q3FY08 Financials About Tundra SemiconductorTundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications, computing and storage companies with System Interconnect products and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO®, PCI, PCI-X, PCI Express®, Power Architecture™, VME, HyperTransport™, Interlaken, and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra's design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s System Interconnect products connect critical components in high performance embedded systems around the world. For more information, please visit www.tundra.com.The difference between pro forma and GAAP earnings is due to stock-based compensation expense, amortization of intangibles associated with Tundra’s acquisitions, restructuring, and goodwill impairment charges. Tundra uses pro forma measures internally to evaluate and manage operating performance as well as to forecast and plan. Tundra Semiconductor Corporation is a public company with common shares listed for trading on the Toronto Stock Exchange (TSX:TUN) in Canada. All figures, unless otherwise noted, are stated in Canadian dollars in accordance with accounting principles generally accepted in Canada. Caution Regarding Forward-Looking InformationThe Company cautions that the forward-looking information in this release is based on certain assumptions made by the Company that may prove to be inaccurate. Assumptions made include, but are not limited to; various aspects of the Company’s future financial performance including anticipated costs, margins and revenues, the competitive environment and product offerings by competitors, improvement in the business environment within which the Company operates, customer adoption of technology giving rise to demand for Company products, customer demand for the Company's products and services, the Company’s ability to maintain and enhance existing customer relationships, and leverage existing partnerships, as well as the Company’s ability to bring to market the products currently under development.Furthermore, the Company cautions that the forward-looking statements in this release are based on current assumptions and expectations that are subject to risks and uncertainties. Actual results may differ due to changes in the factors underlying the Company’s assumptions and expectations such as lower than anticipated customer demand, changes in the timeframe within which customers require new products, deterioration in customer and partner relationships, delays in new product development and new services offerings, product shipping schedules, product mix, competitive products and services offered on better terms or with more desirable features and performance, pricing pressure, exchange rate fluctuations, and changes in the market specifically. Additional information identifying risks and uncertainties is contained in the Company's filings with the various provincial securities commissions available at www.sedar.com. TUNDRA® is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S. and U.K.). TUNDRA and the Tundra logo, Tsi382, and Design.Connect.Go. are registered marks of Tundra Semiconductor Corporation in Canada, European Union, People's Republic of China and the United States. RapidIO is a trademark of the RapidIO Trade Association, Inc. The Power Architecture™ and Power.org™ word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. Other registered and unregistered trademarks are the property of their respective owners. © Copyright 2008 Tundra Semiconductor Corporation. All rights reserved. Information subject to change without notice. For more information contact:
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