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Tundra Semiconductor Expands Design Centre in Hyderabad, India
Design Team Continues to Bring Innovative Products to Market
Hyderabad, India – January 29, 2008 - Tundra Semiconductor Corporation (TSX: TUN), a global leader in System Interconnect, today announced expansion plans in their Hyderabad, India design centre.

Tundra plans to expand its engineering capacity in Hyderabad with specific focus in; ASIC Design/Verification, Physical Implementation, Chip Integration, and Embedded Software Design. The Hyderabad design team will work on developing new and innovative products, using cutting edge process technologies, for Tundra’s next generation System Interconnect solutions.

“The growing high tech hub in Hyderabad is receiving world-wide recognition for its pool of talented design engineers.  Our experienced team in Hyderabad has added significantly to the successful delivery of our new PCIe products to market.  We anticipate continued success from the expanded team in the future and we are pleased to contribute to the vibrant Hyderabad community through job creation,” said Benny Chang, Chief Technology Officer, Tundra Semiconductor.

Tundra’s Hyderabad Design Center was established through the acquisition of the assets of the Systems Solutions Business Unit of Alliance Semiconductor in 2006. Since then, Tundra has made significant investments in this operation and together with the PCI-X, PCI Express and HyperTransport IP and skill set that came with this acquisition, the Hyderabad design team has played an important role in Tundra’s continued success in the global System Interconnect market.

Visit www.tundra.com/india for more information regarding Tundra’s Hyderabad design centre expansion and recruiting efforts.

About Tundra Semiconductor

Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading communications, computing and storage companies with smart System Interconnect products, intellectual property (IP) and design services backed by world-class customer service and technical support. Tundra's track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO®, PCI, PCI-X, PCI Express®, Power Architecture™, VME, HyperTransport™, Interlaken, and SPI4.2. Tundra's products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra's design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra's smart technology connects critical components in high performance embedded systems around the world. For more information, please visit www.tundra.com.

TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation in Canada, the United States, the European Union and the People's Republic of China. Design.Connect.Go. is a trademark of Tundra Semiconductor Corporation. Other registered and unregistered trademarks are the property of their respective owners.

© Copyright 2008 Tundra Semiconductor Corporation. All rights reserved. Information subject to change without notice.

For more information contact:

Keri Zeran
Director, Marketing Communications
Tel: +1.613.697.6788
keri.zeran@tundra.com