About Tundra

Daniel Hoste is President and Chief Executive Officer of Tundra Semiconductor, the world’s leading supplier of System Interconnect to global communications and storage system companies. Daniel joined Tundra in 2005 as Vice President of Products, leading the Company’s operations, product management, and marketing. In 2006, Daniel assumed full management responsibility of the Company, including delivering on the Company’s vision of “accelerating customers success” through innovative technology and leadership in System Interconnect. Daniel has executive leadership experience in management of global semiconductor operations, providing Tundra with the breadth of industry background required to lead Tundra to the next level. 

Daniel is one of the semiconductor industry’s leading executives, with experience in global operations, sales and marketing, and strategic management of technology organizations.

Along with a highly successful track record and global executive and management experience, Daniel brings more than 30 years of experience to Tundra, including 16 years with Freescale Semiconductor, Inc., one of the world’s largest semiconductor companies.  In addition to his work with Freescale, Daniel has extensive research and development experience in the telecom, industrial, and military markets, having worked with a number of the world’s leading technology companies including AMD, Thomson-CSF, ITT, and Philips.

Daniel received his Masters of Science in Electrical Engineering from the Conservatoire National des Arts et Métiers (CNAM) in Paris, France, graduating Magna Cum Laude. He has published several technical papers and has been granted three computer architecture patents.