About Tundra

Stay tuned for upcoming events.

Tundra Semiconductor Reports Q1 FY09 Financial ResultsAugust 28, 2008
Tundra Reports Fourth Quarter Fiscal Year 2008 Financial ResultsJune 5, 2008
Tundra Semiconductor Releases Q3-Fiscal 2008 Financial ResultsFebruary 28, 2008

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Founded in 1995
Corporate headquarters in Ottawa, Ontario
R&D design facilities in Ottawa and Hyderabad, India
Focused on System Interconnect devices based on industry standards
Offering ASIC, System Design Services, and ASIC Product Development Services
Worldwide network of partners, distributors, representatives, and agents
800+ global customers
240+ employees
IPO on the Toronto Stock Exchange in February, 1999, traded as TUN
Fiscal year end - April 30

Leadership Team

	Daniel Hoste	President & Chief Executive Officer
	David Long	Vice President of Finance & Chief Financial Officer
	Cheryl Foy	Vice President, General Counsel & Corporate Secretary
	Mike Lupiano	Vice President of Human Resources
	Tracy Richardson	Vice President of Marketing
	Richard Riker	Vice President of Sales
	Bob Solberg	Vice President of Design Services
	Ed Vopni	Vice President of Engineering & Interim Vice President of Operations

Acess information about Tundra's Board of Directors here.

Tundra supplies the world’s leading communications, computing and storage companies with System Interconnect products and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bringing to market bridges and switches which enable key industry standards: RapidIO®, PCI, PCI-X, PCI Express®, Power Architecture™, VME, HyperTransport™, Interlaken, and SPI4.2. Tundra delivers high performance, high quality products that enable ease of design for customers and are supported by great service. Tundra's design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s technology connects critical components in high performance embedded systems around the world.