08-002IN Chip Integration Lead-Hyderabad, India

Tundra Semiconductor Corporation, based in Ottawa, Ontario Canada is the global leader in System Interconnect providing world-class customer support, leading-edge semiconductor solutions and design services to the world’s foremost communications, networking, storage system and information technology vendors.

We are expanding our Hyderabad Design Center to deliver next generation products using cutting edge technologies. To achieve this we are hiring the best and brightest talent. We understand that our greatest asset is our employees and want to give you an opportunity to contribute and grow!

Ever dream of designing the future?  Design yourself in.  Join the Tundra Team!

Position Summary

As Chip Integration Lead, you will be responsible for ensuring the electrical characteristics of our designs are satisfied in the implementation. This involves specification and Analysis of Power Delivery, On-Chip Noise, and Signal Integrity for high-speed designs to ensure that we deliver first-time-right Silicon.

Responsibilities

In this role you will be responsible for:

• On-chip noise analysis
• Die, package, and PCB power delivery requirements
• Creation of IO timing budgets
• Power Management
• PLL Placement
• Pad ring planning and analysis
• ESD and latch up integrity

Requirements

• Bachelor of electrical  or computer engineering degree or the equivalent (MS preferred)
• 7+ experience in circuit and IO design of high-speed digital devices
• At least 2 deep-submicron tapeouts (90, 65, or 45nm)
• Experience with circuit simulation tools
• Detailed knowledge of scripting languages, particularly PERL and TCL
• Prior experience with low-power design and analysis
• Excellent communication and teamwork skills.

Our ideal candidate has a strong signal integrity experience and can demonstrate an interest in interface development.  We are interested in knowing about your track record of involvement through the design cycle of IC products, and how much experience you have in interface modeling.  Familiarity with high-speed SerDes links would be an asset.

If you envision yourself in this role and would like to be part of a team in a dynamic environment, please contact us at 08-002IN@tundra.com